Flip chip package structure and carrier thereof

专利名称：Flip chip package structure and carrier

thereof

发明人：Jen-Chuan Chen,Chi-Chih Shen,Hui-Shan

Chang,Tommy Pan

申请号：US12228683申请日：20080815公开号：US07791211B2公开日：20100907

专利附图：

摘要：A flip chip package structure including a chip, a carrier, and a plurality of bumpsis provided. The chip has a bonding surface and a plurality of bump pads thereon. The

carrier is disposed corresponding to the chip and includes a substrate and a plurality ofpre-solders. The substrate has a carrying surface and a patterned trace layer thereon.The patterned trace layer has a plurality of traces, and each of the traces has an outwardprotruding bonding portion corresponding to the bump. The line width of the bondingportion is greater than that of the trace. The pre-solders are disposed on the bondingportions, respectively. The bumps are disposed between the bump pads and thecorresponding pre-solders such that the chip is electrically connected to the carrierthrough the bumps.

申请人：Jen-Chuan Chen,Chi-Chih Shen,Hui-Shan Chang,Tommy Pan

地址：Taoyuan County TW,Kaohsiung City TW,Taoyuan County TW,Taipei TW

国籍：TW,TW,TW,TW

代理机构：J.C. Patents

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