专利名称：ELECTRICAL LEAD FOR SURFACE MOUNTING
OF SUBSTRATES
发明人：SEIDLER, Jack申请号：EP95915043.0申请日：19950405公开号：EP07356A1公开日：19970122
摘要：A clip lead is provided for soldering to and supporting a first substratevertically on a second substrate which may be horizontal. The terminal end of the clip isconfigured to form a stable support for the substrate during soldering in a verticalposition to the second substrate by being bent at right angles to and extending underthe first substrate.
申请人：NORTH AMERICAN SPECIALITIES CORPORATION
地址：120-12 28th Avenue Flushing New York 113 US
国籍：US
代理机构：Gleiss & Grosse
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