MX887PHTTR;中文规格书,Datasheet资料

•••••

Power Operation (15 W typical at 25°C)Omnipolar (switches with N or S pole)2.5V to 5.5V OperationCMOS Push-Pull Output

Ultra Low Offset Canceling Amplifiers Provide Sensitive, Accurate, Stable Switching Points and Immunity to Mechanical Stress•Solid State Reliability

•Operating Temperature Range: -40°C to +85°C•RoHS Compliant TSOT23 3-Lead Package

MX887PDescription

The MX887P integrated Hall-Effect switch targets the requirements of low-power portable devices with

battery operating voltages from 2.5V to 5.5V. On-chip power management circuitry reduces the effective average current to just 5A at VSUPPLY = 3VDC .The switch output will transition to the Ground

potential when either a north or south magnetic pole is applied. The removal of a magnetic field will transition the switch to the VSUPPLY potential. Emulating the behavior of a traditional reed switch, together with the advantages of high integration and solid state

reliability, makes the MX887P an ideal replacement in low-power portable device applications.

Applications

•••••

Handheld Portable DevicesWhite Goods

Automotive - Body SystemsSecurity Systems

High Reliability Reed Switch Replacement

Ordering Information

PbRoHS2002/95/ECe3Part

MX887PHTTR

Description

TSOT23 3L Tape & Reel (3000/Reel)

Figure 1. Functional Block Diagram

VSUPPLY1Power Management LogicSwitch3July 29, 2011

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OutputLatchHallSensorOffset CancellationOutput21

MX887P1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31.3 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31.4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31.5 ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41.6 Magnetic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42. Circuit Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43. Manufacturing Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53.4 Board Wash. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

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MX887P1Specifications

1.1 Package Pinout

1.2 Pin Description

3Pin#12NameVSUPPLYOUT2.5V to 5.5V

Description

Push-Pull CMOS Output

123GROUNDGround

1.3 Absolute Maximum Ratings

Parameter

Supply VoltageOutput VoltageMagnetic Flux DensityOutput CurrentJunction TemperatureOperating Ambient TemperatureStorage Temperature

Symbol

VSUPPLYVOUTB-TJTATSTG

Min

-0.5-0.5----40-40

Max

66Unlimited515085150

Units

VDCVGmA°C

Absolute maximum electrical ratings are at 25°C.Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional

operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.

1.4 Electrical Characteristics

Over operating voltage and temperature range unless otherwise specified.

Parameter

Supply Voltage RangeOutput Leakage CurrentOutput On VoltageAwake TimePeriodDuty CycleSupply Current

ConditionsOperating

VOUT=5.5V, BRPN < B < BRPS

IOUT=1mA, VDD=3.0V

---Awake (enabled)Asleep (disabled)Average (Calculated)

ISUPPLY

Symbol

VSUPPLYILKGVOUT---

Minimum

2.5--------

Typical

--100--0.1--5

Maximum

5.513009090-2815

UnitsVDC

AmVsms%mAAA

Notes: 1. BOPX = operating point (output turns ON); BRPX = release point (output turns OFF).

2. Typical data is at 25°C and VSUPPLY = 3V.

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MX887P1.5 ESD Rating

ESD Rating (Human Body Model)

2000V

1.6 Magnetic Characteristics

Over operating voltage and temperature range unless otherwise specified.

Parameter

Operating PointsDue to North Pole AppliedDue to South Pole AppliedRelease Points

Due to North Pole AppliedDue to South Pole AppliedHysteresisNotes:

North Pole to Branded SideSouth Pole to Branded Side

| BOPX - BRPX |

BRPNBRPS

-6---5

-6--G

ConditionsNorth Pole to Branded SideSouth Pole to Branded Side

Symbol

BOPNBOPS

Minimum

-60-

Typical

--

Maximum

-60

Units

G

G

BHYS

1. As used here, negative flux densities are defined as less than zero (algebraic convention); -50G<+10G.2. BOPX = operating point (output turns ON); BRPX = release point (output turns OFF).3. Typical data is at 25°C and VSUPPLY = 3V.

2Circuit Description

The MX887P Power Hall-Effect Switch consists of a Hall element, small-signal amplifier, latch, and CMOS push-pull output. Offset cancellation circuitry rejects errors in signal stages and the influence of mechanical stress on the Hall element. This technique, together with a precision threshold generator and comparator,

produces highly accurate magnetic switch points. The Hall element is activated for a small fraction of an operating cycle, then latched in that sample state for the remainder of the period. By using this technique, very low power consumption is achieved.

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MX887P3Manufacturing Information

3.1 Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our

devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

DeviceMX887P

Moisture Sensitivity Level (MSL) Rating

MSL 3

3.2 ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

3.3 Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed.

DeviceMX887P

Maximum Temperature x Time

260°C for 30 seconds

3.4 Board Wash

Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is

acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.

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MX887P3.5 Mechanical Dimensions

3.5.1TSOT23 3-Lead Package

2.80 / 3.00(0.110 / 0.118)32.60 / 3.00(0.102 / 0.118)10.35 / 0.51(0.014 / 0.020)0.75 / 0.90(0.030 / 0.035)0.70 / 0.80(0.028 / 0.031)5º NOM7º NOM20.60 REF(0.0236 REF)0.25 BSC(0.0098 BSC)GAUGE PLANE0.10 / 0.25(0.004 / 0.010)0.95(0.037)1.50 / 1.70(0.059 / 0.067)0.37 / 0.47(0.015 / 0.019)2.70(0.106)0º / 8º0.10 MIN(0.004 MIN)Recommended PCB Land Pattern1.05(0.041)0.60(0.024)0.00 / 0.10(0.000 / 0.004)0.95 BSC(0.037 BSC)1.90 BSC(0.0748 BSC)Dimensionsmm MIN / mm MAX(inches MIN / inches MAX)Notes: (Unless otherwise specified)1. Dimension “D” does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.10mm (0.004 inches) per side.2. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.15mm (0.006 inches) per side.3. Package top may be smaller than package bottom. Dimensions “D” and “E1” are determined at the outermost extreme of the plastic body excluding mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between top and bottom of the plastic body.3.5.2Tape & Reel Packaging

178 DIA.(7.01 DIA.)0.25 ± 0.05(0.001 ± 0.002)ø1.5, +0.1, -0(ø0.059, +0.004, -0)P=4.0 ± 0.1(0.157 ± 0.004)2.0 ± 0.05(0.079 ± 0.002)3.5 ± 0.05(0.138 ± 0.002)1.75 ± 0.1(0.069 ± 0.004)Top CoverTape Thickness0.066 MAX.(0.003 MAX.)BO=3.2 ± 0.1(0.126 ± 0.004)Embossed CarrierK0=1.1 ± 0.1(0.043 ± 0.004)P=4.0 ± 0.1(0.157 ± 0.004)AO=3.2 ± 0.1(0.126 ± 0.004)ø1.1 ± 0.1(0.043 ± 0.004)W=8.0 ± 0.2(0.315 ± 0.008)Dimensionsmm(inches)NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2EmbossmentFor additional information please visit our website at: www.clare.com

Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-MX887P-20110729©Copyright 2011, Clare, Inc.

All rights reserved. Printed in USA.7/29/2011

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分销商库存信息:

IXYS

MX887PHTTR