专利名称：Acidic polishing slurry for the chemical-mechanical polishing of SiO2 isolation layers
发明人：Kristina Vogt,Lothar Puppe,Chun-Kuo Min,Li-Mei Chen
申请号：US10680831申请日：20031007
公开号：US20040065864A1公开日：20040408
摘要：An acidic polishing slurry for chemical-mechanical polishing, containing 0.1 to 5%by weight of a colloidal silica abrasive and 0.5 to 10% by weight of a fluoride salt, isdistinguished by a higher polishing selectivity with regard to the rate at which silica isremoved compared to the rate at which silicon nitride is removed compared to aconventional polishing slurry containing pyrogenic silica.
申请人：VOGT KRISTINA,PUPPE LOTHAR,MIN CHUN-KUO,CHEN LI-MEI
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