专利名称：THERMOPLASTIC MOLDING
COMPOSITIONS HAVING IMPROVEDPLATEABILITY
发明人：JANARTHANAN, Venkatarayaloo,BRASSARD,
Roland, P.,PIEJKO, Karl-Erwin,GRAHAM, Sara,D.
申请号：EP99928670.1申请日：19990615公开号：EP1090071B1公开日：20060118
摘要：A thermoplastic molding composition containing a major amount of
polycarbonate and a lesser amount of butadiene based graft polymer is disclosed. Theinventive composition is especially suited for the preparation of a molded article whereinat least some of its surface is metallized by an electroless plating process. The thusplated article is characterized in its improved heat resistance and excellent adhesion of itsmetal plating.
申请人：BAYER AG
地址：US
国籍：US
代理机构：Feldhues, Michael L.F.
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